The Solution: Deep Submicron
Economic Considerations:
- MUST follow the technological trends otherwise no suppliers
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- Radiation tolerance of thin gate oxide
- rad-induced holes removal by e-tunneling
- very few interface traps
- Features of deep submicron technology
- large scale integration density -> acceptable density for radiation tolerant design
- performance -> speed, noise and matching are good
- low power
- main stream, large volume process -> high yield, low cost
- attractive for pixel readout chip
- radiation tolerance
- main radiation tolerance limitation of deep submicron: leakage currents originating from charge trapping in thick oxides